Camera module

ABSTRACT

The present invention relates to a camera module, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a housing configured to protect the image sensor and mounted therein with camera constituent parts, and plural pieces of lenses mounted on the housing, wherein a surface of the housing is metalized.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/345,318, filed Mar. 17, 2014; which is the U.S. national stageapplication of International Patent Application No. PCT/KR2012/007357,filed Sep. 14, 2012; which claims priority to Korean Application No.10-2011-0093581, filed Sep. 16, 2011, the disclosures of each of whichare incorporated herein by reference in their entirety.

TECHNICAL FIELD

The teachings in accordance with exemplary embodiments of this inventionrelate generally to a camera module.

BACKGROUND ART

Generally, an optical device includes a lens transfer device moving alens to an optical direction, where the lens transfer device uses anactuator such as an electromagnetic motor or a piezoelectric actuator asa means for generating a power. A cam or a screw is used as a means fortransmitting power generated by the actuator.

Thus, the lens transfer device uses the power generated by the actuatorto adjust a focus by moving the lens to an optical direction, wherebyauto-focusing function is realized.

Especially, in recent times, mobile terminals and PDAs (personal digitalassistants) are largely and frequently mounted with a camera module. Thecamera module may be equipped with an AF (Auto Focusing) function, and aVCM (Voice Coil Motor) is used for auto focusing function, where the VCMperforms the auto focusing function by vertically moving a lens within apredetermined size of space. In order to perform the AF function in theconventional camera module, a lens position is changed to focus on aparticular object.

Meanwhile, the electromagnetic wave is in an invisible odorless thinglike the air we breathe, and hangs around us to disturb otherelectromagnetic waves called EMI (Electromagnetic Interference) which inturn can interfere with the performance of various sensitive wirelessdevices nearby, causing industrial damages, and resulting in fatalinfluences directly or indirectly on human body.

Particularly, a camera module is mounted on portable terminals,notebooks and other electronic devices generating electromagnetic wave,which may result in erroneous operation of the electronic devices, suchthat multi-angled researches and technical developments are being wagedto reduce the electromagnetic wave.

DISCLOSURE Technical Problem

Accordingly, the present invention has been made keeping in mind theabove disadvantages/problems occurring in the prior art, and the presentinvention provides a camera module configured to minimize or shield theEMI and to simplify constituent parts in the camera module.

Technical problems to be solved by the present invention are notrestricted to the above-mentioned, and any other technical problems notmentioned so far will be clearly appreciated from the followingdescription by skilled in the art.

Technical Solution

In order to solve these problems, the present invention provides acamera module, the camera module comprising: a PCB (Printed CircuitBoard) mounted with an image sensor; a housing configured to protect theimage sensor and mounted therein with camera constituent parts; andplural pieces of lenses mounted on the housing, wherein surface of thehousing is metalized.

In some exemplary embodiments, the camera module may further comprise anauto focusing device focusing an image inputted to the image sensorthrough the plural sheets of lenses.

In some exemplary embodiments, the housing may be formed with electrodelines realized by a surface electrode forming technology.

In some exemplary embodiments, the surface electrode forming technologymay be an MID (Molded Interconnect Device) process.

In some exemplary embodiments, the auto focusing device may be one of anMEMS (micro electro mechanical system) actuator, a VCM (Voice CoilMotor), an SMA (Shape Memory Alloy) actuator and a piezoelectric elementactuator.

In some exemplary embodiments, the electrode line may be electricallyconnected to the actuator.

In some exemplary embodiments, the metalized housing surface may bespaced apart from the electrode line at a predetermined distance.

In some exemplary embodiments, the housing may include at least one ormore impurities, and may be injection-molded with a material that isphysically deformed, in a case at least one of light and heat is appliedthereto.

In some exemplary embodiments, the electrode line may be an area exposedto light from the housing in which a physical substance is changed to aconductible state.

In some exemplary embodiments, the electrode line may be a plated layerplated on the exposed area of the housing.

In some exemplary embodiments, the light exposing the exposed area maybe laser beam.

In some exemplary embodiments, the electrode line may be formed on anyone of an external surface of the housing, an inner surface of thehousing or both the external and inner surfaces of the housing.

In some exemplary embodiments, the constituent parts may be parts for FF(Fixed Focus) obtaining an image of an object using a fixed focusingmethod.

In some exemplary embodiments, the FF parts may include a lens barrelembedded with lenses, a holder screwed to the lens barrel, an imagesensor converting an optical image inputted through the lenses to anelectrical signal, and a PCB (Printed Circuit Board) mounted with theimage sensor.

In some exemplary embodiments, the constituent parts may be parts for AF(Auto Focusing) obtaining an image of an object using an auto focusingmethod.

In some exemplary embodiments, the AF parts may include a lens barrelincluding a plurality of lenses receiving an optical image of theobject, an actuator moving the lens barrel for auto focusing, and a PCB(Printed Circuit Board) mounted with an image sensor converting anoptical image inputted through the lenses to an electrical signal.

In some exemplary embodiments, the constituent parts may be partsconfigured to flash on an object.

Advantageous Effects

A camera module according to the present invention has an advantageouseffect in that an external surface of a housing is metalized to shieldan EMI and an electrode line is formed along the shape of the housing aswell, whereby there is no need of mounting additional parts forcomplicated wiring, a can assembly process can be dispensed with, aconnecting process such as soldering that may cause a thermaldeformation can be dispensed with to reduce the manufacturing cost,reliability against drop can be improved by reduced weight, and a lenshaving a large diameter can be mounted at an external space of thecamera module used to be occupied by the can.

Another advantageous effect is that an electrode line can be formedalong the shape of a housing to enable an integral injection molding ofthe housing with parts that can be embedded inside the housing, wherebythe number of parts can be reduced for simplification to reduce themanufacturing cost and to simplify the assembly process of the parts.

BRIEF DESCRIPTION OF THE DRAWINGS

The teachings of the present invention can be readily understood byconsidering the following detailed description in conjunction with theaccompanying drawings, in which:

FIG. 1 is a schematic perspective view illustrating a camera modulehaving an EMI shielding function according to an exemplary embodiment ofthe present invention;

FIG. 2 is a mimetic cross-sectional view illustrating a camera modulehaving an EMI shielding function according to an exemplary embodiment ofthe present invention;

FIG. 3 is a mimetic view illustrating a state of an external surface ofa housing in a camera module according to an exemplary embodiment of thepresent invention;

FIG. 4 is a schematic cross-sectional view illustrating a method formingan electrode pattern on a housing using MID process according to anexemplary embodiment of the present invention; and

FIG. 5 is a schematic cross-sectional view illustrating another methodforming an electrode pattern on a housing using MID process according toan exemplary embodiment of the present invention.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present invention will bedescribed in detail with reference to the accompanying drawings.

In describing the present disclosure, detailed descriptions ofconstructions or processes known in the art may be omitted to avoidobscuring appreciation of the invention by a person of ordinary skill inthe art with unnecessary detail regarding such known constructions andfunctions. Accordingly, the meaning of specific terms or words used inthe specification and claims should not be limited to the literal orcommonly employed sense, but should be construed or may be different inaccordance with the intention of a user or an operator and customaryusages. Therefore, the definition of the specific terms or words shouldbe based on the contents across the specification.

Furthermore, directional terminology, such as “top,” “bottom,” “front,”“back,” etc., may be used with reference to the orientation of theFigures being described. Because components of embodiments may bepositioned in a number of different orientations, the directionalterminology is used for purposes of illustration and is in no waylimiting. It is to be understood that other embodiments may be utilizedand structural or logical changes may be made without departing from thescope of the present invention. The following detailed description,therefore, is not to be taken in a limiting sense, and the scope of thepresent invention is defined by the appended claims.

FIG. 1 is a schematic perspective view illustrating a camera modulehaving an EMI function according to an exemplary embodiment of thepresent invention, and FIG. 2 is a mimetic cross-sectional viewillustrating a camera module having an EMI function according to anexemplary embodiment of the present invention.

The camera module having an EMI shielding function according to anexemplary embodiment of the present invention provides a technologycapable of effectively shielding an EMI (Electromagnetic Interference)from an external housing of the camera module.

Referring to FIG. 1, the camera module includes constituent partsconfigured to photograph an object, and a metalized housing formed on anexternal surface of the camera module and embedded with the constituentparts.

To be more specific, the camera module includes a PCB (Printed CircuitBoard) mounted with an image sensor; a housing (200) configured toprotect the image sensor and mounted therein with camera constituentparts; and plural pieces of lenses mounted on the housing, wherein asurface of the housing is metalized. The camera module may furthercomprise an auto focusing device focusing an image inputted to the imagesensor through the plural sheets of lenses.

Furthermore, the housing may be formed with electrode lines (201)realized by a surface electrode forming technology, where the surfaceelectrode forming technology may be an MID (Molded Interconnect Device)technology.

Still furthermore, the auto focusing device may be one of an MEMS (microelectro mechanical system) actuator, a VCM (Voice Coil Motor), an SMA(Shape Memory Alloy) actuator and a piezoelectric element actuator. Thehousing (200) is preferably a plastic housing, and may be formed withthe electrode lines (201) realized by the surface electrode formingtechnology. The surface electrode forming technology may be an MID(Molded Interconnect Device) technology, where the electrode lines(201), which are current-flowing paths, may be called conductive lines.

The electrode lines are electrically connected to the constituent partsto be applied with voltages and a control signal for driving the cameramodule, or to transmit an electric signal to an image of an objectphotographed by the camera module.

The MID technique is widely used in various electronic devices to hollowpackages. That is, the MID technique is such that a light-exposed areais changed in physical properties to become electrode lines, or a platedlayer is formed on the physical property-changed area to allow theelectrode lines to be formed along the shape of the housing (200).

Furthermore, the parts may be parts for FF (Fixed Focus) configured toobtain an image of an object using a fixed focusing method, or parts forAF (Auto Focus) configured to obtain an image of an object using an autofocusing method. At the same time, the parts may be parts configured toshine a flashlight on an object, e.g., various parts (PCBs, electricalconnectors) including elements for flashlight, and/or elements fordriving flashlight. The housing (200) may further include a separatereceptor and a window for flashlight, where an optical element and a PCBmay be contained inside the receptor, and the window functions to allowlight emitted from the flashlight element to pass therethrough and toilluminate the object. The optical element may include one of alight-emitting chip embedded package, a light-emitting chip embeddedmodule, and a PCB mounted with a light-emitting chip.

The optical element may include an LED (Light Emitting Diode) element,where the LED element is characterized by advantages of high efficiency,speedy response, long life, miniaturization, lightness and reducedenergy consumption caused by low power consumption, and by an advantageas an green (environment-friendly) light source with no generation ofmonoxide and mercury, and with easy waste disposal. The small-sized LEDelement having a high luminance character is adequate for flashlightillumination.

Thus, the camera module according to an exemplary embodiment of thepresent invention is advantageous in that a flashlight illuminatingfunction can be added to dispense with a separate illumination device,whereby a bright photographing is possible even in the night.

Furthermore, the FF parts may include a lens barrel embedded withlenses, a holder screwed to the lens barrel, an image sensor convertingan optical image inputted through the lenses to an electrical signal,and a PCB (Printed Circuit Board) mounted with the image sensor.

Referring to FIG. 2, the AF parts include a lens barrel (100) includinga plurality of lenses receiving an optical image of the object, anactuator (110) moving the lens barrel for auto focusing, and a PCB(Printed Circuit Board, 130) mounted at a bottom surface of the lensbarrel (100) with an image sensor (120) converting an optical imageinputted through the lenses to an electrical signal.

The electrode lines (201) formed on the housing (200) by way of MIDtechnology are electrically connected to the actuator (110) and suppliedwith voltages for driving the actuator (110). The actuator (110) may beone of an MEMS (micro electro mechanical system) actuator, a VCM (VoiceCoil Motor), an SMA (Shape Memory Alloy) actuator and a piezoelectricelement actuator. The VCM may include a bobbin, a coil, a permanentmagnet and a yoke.

The lens barrel (100) is formed at a periphery thereof with screwthreads which are in turn screwed to those of the inner surface of thebobbin, where the bobbin is coupled to the lens barrel (100). The lensbarrel (100) is wound at the periphery thereof by a coil to a directionperpendicular to a magnetic flux, where the coil interacts with thepermanent magnet.

The lens barrel (100), serving as a means to fix and protect a pluralityof lenses, is sequentially stacked at an inner surface thereof with theplurality of lenses along an axial direction, where the plurality oflenses is capable of receiving an optical image of an object. The yokefunctions to prevent a magnetic field formed between the coil and thepermanent magnet from being discharged outside.

In a case a voltage is applied to the coil, a current flowing in thecoil and the magnetic field of the permanent magnet interacts accordingto Fleming's left-hand law, whereby the bobbin is applied with a forceupwards of the optical direction. At this time, a distance moved upwardsalong the optical direction by the lens barrel and the bobbin increasesas the intensity of current applied to the coil increases.

MODE FOR INVENTION

FIG. 3 is a mimetic view illustrating a state of an external surface ata housing in a camera module according to an exemplary embodiment of thepresent invention

As described above, the external surface of the housing at the cameramodule is metalized. The metalized external surface serves to shield theEMI transmitted from outside and simultaneously prevent EMI generatedfrom constituent parts embedded in the camera module from beingdischarged outside.

Thus, the camera module according to an exemplary embodiment of thepresent invention is advantageous in that the external surface of thehousing at the camera module is metalized to effectively shield the EMIto enable a dispensation with a separate part such as a metal can.

The housing of the camera module is formed with electrode lines (201)realized by the MID technology, for being electrically connected toconstituent parts inside the camera module. Referring to FIG. 3, theelectrode lines (201) should not be electrically connected to themetalized surface (202). If the electrode lines (201) are electricallyconnected to the metalized surface (202), the electrode lines (201) andthe metalized surface (202) are short-circuited. Thus, the metalizedsurface (202) is spaced apart from the electrode lines (201) at apredetermined distance, and a non-metalized housing (203) is exposedbetween the metalized surface (202) and the electrode lines (201).

FIG. 4 is a schematic cross-sectional view illustrating a method formingan electrode pattern on a housing using MID process according to anexemplary embodiment of the present invention, and FIG. 5 is a schematiccross-sectional view illustrating another method forming an electrodepattern on a housing using MID process according to an exemplaryembodiment of the present invention.

The MID technology, which is a technology capable of forming electrodelines along the shape of the housing, can simplify electrical wiringsand constituent parts. For a non-limiting example, an MEMS actuatorbarrel may be integrally injection-molded with an external housing toallow the electrical wirings to be wired freely and three-dimensionallyalong the shape of an integrally molded article using the MIDtechnology.

Furthermore, the housing (203) of the camera module includes at leastone or more impurities, and may be preferably injection-molded with amaterial whose physical properties are changed, in a case at least oneor more of light and heat is applied thereto.

That is, as shown in FIG. 4, the housing (203) injection-molded with amaterial containing impurities is changed in physical properties at apredetermined area (204) where light is irradiated. That is, theimpurities contained in the predetermined area (204) of the exposedhousing (203) is evaporated or sublimated by receiving an optical energyto change materials in the impurities-existent housing (203). At thistime, the impurities may change the physical properties of thelight-exposed predetermined area (204) of the housing (203) to aconductive state, or change the light-exposed predetermined area (204)to that of physical properties easy to be plated or coated, albeit beingnon-conductible.

Thus, the light-exposed predetermined area (204) of the housing (203) inFIG. 4 is an area for electrode lines or an area easy to be plated orcoated. In case the light-exposed predetermined area (204) of thehousing (203) in FIG. 4 is an area that is easily plated or coated, aconductive plated layer (205) may be formed on the predetermined area(204) to thereby realize electrode lines, as illustrated in FIG. 5.

Furthermore, the light exposure for forming the electrode lines on thehousing (203) may be selectively performed using a mask. At this time,the light is preferably laser beam. The electrode lines may be formed onany one of an external surface of the housing (203), an inner surface ofthe housing, or both the external and inner surfaces of the housing(203).

As apparent from the foregoing, the camera module according to thepresent invention has an advantageous effect in that an external surfaceof a housing is metalized to shield an EMI and electrode lines areformed along the shape of the housing as well, whereby there is no needof mounting additional parts for complicated wiring, a can assemblyprocess can be dispensed with, a connecting process such as solderingthat may cause a thermal deformation can be dispensed with to reduce themanufacturing cost, reliability against drop can be improved by reducedweight, and a lens having a large diameter can be mounted at an externalspace of the camera module used to be occupied by the can.

Another advantageous effect is that an electrode line can be formedalong the shape of a housing to enable an integral injection molding ofthe housing with parts that can be embedded inside the housing, wherebythe number of parts can be reduced for simplification to reduce themanufacturing cost and to simplify the assembly process of the parts.

The previous description of the present invention is provided to enableany person skilled in the art to make or use the invention. Variousmodifications to the invention will be readily apparent to those skilledin the art, and the generic principles defined herein may be applied toother variations without departing from the spirit or scope of theinvention. Thus, the invention is not intended to limit the examplesdescribed herein, but is to be accorded the widest scope consistent withthe principles and novel features disclosed herein.

INDUSTRIAL APPLICABILITY

Exemplary embodiments of the camera module according to the presentinvention have an industrial applicability in that an external surfaceof a housing is metalized to shield the EMI and an electrode line isformed along the shape of the housing.

What is claimed is:
 1. A camera module comprising: a Printed CircuitBoard (PCB) mounted with an image sensor; a housing disposed on an uppersurface of the PCB; at least one lens disposed inside the housing; afocusing device focusing an image inputted to the image sensor throughthe lens; and an electrode line formed along an outer surface of thehousing, wherein the electrode line is electrically connected with thePCB and the focusing device, wherein the housing includes a recess partinwardly recessed from the outer surface of the housing, wherein theelectrode line is extended along an outer surface of the recess part,and wherein the outer surface of the recess part is disposed furtherinward than a terminal of the PCB.
 2. The camera module of claim 1,wherein the electrode line comprises a first portion extended in adirection of an optical axis and a second portion vertically extendedfrom a bottom end of the first portion within the outer surface of therecess part.
 3. The camera module of claim 1, further comprising a metallayer formed along the outer surface of the housing, wherein theelectrode line is electrically insulated from the metal layer.
 4. Thecamera module of claim 1, wherein the housing further includes a taperpart inclinedly connected with the recess part and the outer surface ofthe housing, wherein the electrode line is extended along an outersurface of the taper part.
 5. The camera module of claim 1, wherein theelectrode line is formed by a surface electrode forming technology. 6.The camera module of claim 5, wherein the surface electrode formingtechnology is an MID (Molded Interconnect Device) process.
 7. The cameramodule of claim 1, wherein the focusing device is one of an MEMS (microelectro mechanical system) actuator, a VCM (Voice Coil Motor), an SMA(Shape Memory Alloy) actuator and a piezoelectric element actuator. 8.The camera module of claim 3, wherein the metal layer is spaced apartfrom the electrode line at a predetermined distance.
 9. The cameramodule of claim 5, wherein the housing includes at least one impurity,and wherein the housing is formed with a material that is physicallychanged by the impurity, in a case at least one of light and heat isapplied thereto.
 10. The camera module of claim 9, wherein the electrodeline is an exposed area of the housing exposed to light, and physicalproperties of the exposed area are changed to a conductive state by theimpurity.
 11. The camera module of claim 9, wherein the electrode lineis a plated layer plated on an exposed area of the housing.
 12. Thecamera module of claim 10, wherein the light exposing the exposed areais laser beam.
 13. The camera module of claim 1, wherein constituentparts are accommodated in the housing, and wherein the constituent partsare parts for Fixed Focus (FF) obtaining an image of an object using afixed focusing method.
 14. The camera module of claim 13, wherein theFixed Focus (FF) parts include a lens barrel embedded with lenses, aholder screwed to the lens barrel, an image sensor converting an opticalimage inputted through the lenses to an electrical signal, and a PCB(Printed Circuit Board) mounted with the image sensor.
 15. The cameramodule of claim 1, wherein constituent parts are accommodated in thehousing, and wherein the constituent parts are parts for AF (AutoFocusing) obtaining an image of an object using an focusing method. 16.The camera module of claim 15, wherein the AF parts include a lensbarrel including a plurality of lenses receiving an optical image of theobject, an actuator moving the lens barrel for focusing, and a PCB(Printed Circuit Board) mounted with an image sensor converting anoptical image inputted through the lenses to an electrical signal. 17.An optical device comprising: a Printed Circuit Board (PCB) mounted withan image sensor; a housing disposed on an upper surface of the PCB; atleast one lens disposed inside the housing; an focusing device focusingan image inputted to the image sensor through the lens; and an electrodeline formed along an outer surface of the housing, wherein the electrodeline is electrically connected with the PCB and the focusing device,wherein the housing includes a recess part inwardly recessed from theouter surface of the housing, wherein the electrode line is extendedalong an outer surface of the recess part, wherein the outer surface ofthe recess part is disposed further inward than a terminal of the PCB,and wherein the electrode line comprises a first portion extended in adirection of an optical axis and a second portion vertically extendedfrom a bottom end of the first portion within the outer surface of therecess part.